·
|
Net revenues $2,531 million, up
8.9% sequentially and 27.0%
year-over-year
|
·
|
Gross margin of 38.3%; best
result in 37 quarters
|
·
|
Net income of $356 million,
diluted EPS of $0.39, as
reported
|
·
|
Adjusted EPS of $0.18 compared
to $0.07 and -$0.28 in the prior and year-ago quarters,
respectively*
|
Net Revenues By Market Segment
/ Channel (a)
(In %) |
Q2
2010
|
Q1
2010
|
Q2
2009
|
Market
Segment / Channel:
|
|||
Automotive
|
14%
|
14%
|
12%
|
Computer
|
12%
|
12%
|
13%
|
Consumer
|
13%
|
12%
|
11%
|
Industrial
& Other
|
8%
|
8%
|
8%
|
Telecom
|
32%
|
35%
|
41%
|
Total
OEM
|
79%
|
81%
|
85%
|
Distribution
|
21%
|
19%
|
15%
|
Operating
Segment
(In Million US$) |
Q2
2010
Net Revenues |
Q2
2010
Operating Income (Loss) |
Q1
2010
Net Revenues |
Q1
2010
Operating Income (Loss) |
Q2
2009
Net Revenues |
Q2
2009
Operating Income (Loss) |
ACCI
(a)
|
1,045
|
99
|
909
|
48
|
712
|
(71)
|
IMS
(a)
|
945
|
137
|
811
|
92
|
605
|
(22)
|
Wireless
(b)
|
525
|
(137)
|
587
|
(116)
|
650
|
(126)
|
Others
(c)(d)
|
16
|
(8)
|
18
|
(44)
|
26
|
(209)
|
TOTAL
|
2,531
|
91
|
2,325
|
(20)
|
1,993
|
(428)
|
In
Million US$
|
First
Half 2010
|
First
Half 2009
|
||
Product
Segment
|
Net
Revenues
|
Operating
Income
(Loss)
|
Net
Revenues
|
Operating
Income
(Loss)
|
ACCI
|
1,955
|
147
|
1,332
|
(99)
|
IMS
|
1,755
|
228
|
1,110
|
(17)
|
Wireless
|
1,112
|
(253)
|
1,169
|
(233)
|
Others
|
34
|
(51)
|
42
|
(472)
|
TOTAL
|
4,856
|
71
|
3,653
|
(821)
|
|
·
|
66.88
million shares of Micron common stock, which are held as marketable
securities. A substantial portion of such Micron shares is
hedged;
|
|
·
|
future
full ownership of the Numonyx M6 facility in Catania, Italy, which ST has
committed to contribute to a new photovoltaic joint initiative among
Enel, Sharp and ST; and
|
|
·
|
in
connection with the transaction, ST has a payable of $77.8 million due to
Francisco Partners at the end of the shares lock-up
period.
|
|
·
|
Approval
of the Company’s 2009 statutory accounts reported in accordance with
International Financial Reporting Standards
(IFRS);
|
|
·
|
The
reappointment for a three-year term, expiring at the 2013 Annual General
Meeting, for the following members of the Supervisory Board: Mr. Raymond
Bingham and Mr. Alessandro Ovi; and
|
|
·
|
The
distribution of an annual cash dividend of US$0.28 per share, to be paid
in four equal quarterly
installments.
|
·
|
ST
had continued success with its 32-bit Power Architecture® SPC56 family of
automotive microcontrollers (MCUs)
with:
|
|
o
|
a
major powertrain platform design win from a leading tier-one OEM, based on
ST’s recently announced 55nm (nanometer) embedded Flash
technology;
|
|
o
|
two
body-control application design wins based on its SPC560B MCU family in
North America;
|
|
o
|
and
a major design win in Europe for safety
applications.
|
·
|
Also
in body electronics, ST’s latest-generation VIPower™ (Vertical Intelligent
Power) technology gained a design win for a light-control module from a
major Korean car maker.
|
·
|
Additionally,
ST strengthened its leadership in advanced safety applications, in
partnership with Mobileye, with the development of the third generation of
its EyeQ3 safety processor with four times more computational power than
the previous generation, plus support for USB, FlexRay and Ethernet
communications.
|
·
|
ST
gained an important design win for its leading-edge multi-standard (AM/FM,
DAB, HD) radio-receiver DSP from a major OEM in Germany targeting new
platforms for a major car maker, expected to begin production in
2013.
|
·
|
ST
strengthened its leadership position in navigation with production
deployment of its Cartesio+ processor SoC enabling cost-optimized
dashboard systems combining navigation technology with infotainment
features.
|
·
|
In
set-top box (STB) chips:
|
|
o
|
ST
gained significant design wins for its cost-effective integrated STi7162 /
STi7167 platforms in terrestrial and cable STB markets, and for its
STi7141 DOCSIS platform in Europe and
China;
|
|
o
|
ST
delivered its first platforms for the DVB-T2 digital-terrestrial HDTV
market in the UK, and delivered integrated DVB-S2 STi7111 platforms in
large volume for HD+ / CI+ deployment in Central
Europe;
|
|
o
|
ST
is ramping up in production of its STi5189 cost-optimised satellite
demodulator and MPEG2 decoder platform for markets in India and Latin
America, in addition to significantly contributing to the first deployment
of HDTV STBs in India;
|
|
o
|
By
the end of Q2, cumulative shipments of ST’s state-of-the-art
55nm STB platforms reached more than 10 million
units.
|
·
|
In
integrated digital TV (iDTV) and monitor
applications:
|
|
o
|
ST
gained several design-wins for an enhanced version of its FLI7510 SoC,
which enables 3D TV in a single-chip for 120Hz mainstream iDTVs. The
integration, processing power and flexibility of the ‘Freeman’ family
of SoCs has allowed ST to gain traction in the integrated
broadcast and broadband-Internet iDTV
market.
|
|
o
|
ST
achieved two design-wins for its FLI326xx Faroudja™-based display
controllers for LCD TVs, and three design wins at tier-one customers for
its high-end STDP802x Faroudja-based LCD-controller SoC family, which
offers advanced color processing and DisplayPort and HDMI
receivers.
|
|
o
|
Additionally,
ST’s proposed iDP (internal DisplayPort) interface standard for use in
next generation LCD TVs, in cooperation with LG Display, was adopted by
VESA (The Video Electronics Standards
Association).
|
·
|
In
audio ICs:
|
|
o
|
ST
strengthened its leadership position in flat-panel TVs for its family of
Sound Terminal ICs, gaining design wins with two key players in China.
Cumulative shipments in 2010 for Sound Terminal ICs have already exceeded
25 million units.
|
|
o
|
ST
announced production availability of an analog-input 2x100W class-D power
amplifier, extending its range of devices that deliver audiophile sound
quality.
|
·
|
ST announced full availability of
a 32nm platform for the design and development of application-specific
integrated circuits (ASICs) for networking applications. Central to the
|
|
platform is the industry’s first
Serializer-Deserializer (SerDes) IP available in 32nm ‘bulk’
silicon.
|
·
|
ST
unveiled the SPEAr1300 architecture that will be the backbone for new
members of its SPEAr® family of microprocessors, targeting
high-performance connectivity and embedded applications. ST has already
gained a design win for this family from a major
communications-infrastructure OEM.
|
·
|
ST gained two design wins for
motor-controller ICs implemented in the Company’s BCD technology from two
leading customers, for next-generation enterprise and desktop hard-disk
drive applications.
|
·
|
Highlights
included
|
|
o
|
several
design wins for accelerometers with leading mobile device makers, who
selected ST’s MEMS because of the chip’s extremely low current consumption
and embedded motion processing
features;
|
|
o
|
design
wins for 3-axis gyroscopes with several top-tier mobile phone
makers;
|
|
o
|
starting
high-volume production of three-axis digital gyroscopes to be used in
next-generation smartphones;
|
|
o
|
and
qualification from Japanese game manufacturer for two-axis analog
gyroscopes.
|
·
|
ST
also introduced new products
including
|
|
o
|
the
LIS3DH 3-axis digital-output accelerometer that combines drastically
reduced power consumption, miniature footprint and enhanced
functions;
|
|
o
|
and
the L3G4200DH high-performance three-axis digital-output gyroscope
embedding power-management capabilities for new applications and advanced
user interfaces in gaming, motion tracking and image
stabilization.
|
·
|
ST
gained design wins for its smart reset ICs from two leading mobile-phone
makers and from an HDD maker for a pressure
sensor.
|
·
|
ST
also launched several new devices
including
|
|
o
|
an
IC that simplifies the design of power management, monitoring and safety
equipment, by allowing direct and accurate measurement of current in power
lines operating at up to 70V;
|
|
o
|
a
super-small power-efficient digital temperature sensor allowing portable
devices to benefit from features such as intelligent thermal
protection.
|
·
|
ST
unveiled the SPV1020, the industry’s first IC to combine important
power-optimization and power-conversion functions for solar
generators.
|
·
|
ST’s
new FlexSPIN SPIbus-configurable multi-motor driver IC entered into full
production.
|
·
|
ST
achieved key design wins from a major CFL (compact fluorescent lamp)
manufacturer for a large European retail store chain and from a major
worldwide appliance manufacturer for its new SmartDRIVE family. In
addition, ST gained multiple design-ins from OEMs in the US and Asia for
power devices for single-board computer
designs.
|
·
|
ST
dramatically increased achievable power density with its latest generation
MDmesh™ V power MOSFETs with new advanced high-performance 1mm-high power
package, developed in cooperation with Infineon. The new devices have
already received first pre-production
orders.
|
·
|
ST
gained design wins in automotive, lighting and other applications, orders
for MDmesh V transistors for solar power inverter modules, and
qualification at a major US plasma-generator maker and at several
broadcast customers.
|
·
|
ST
gained multiple design wins for its ULVF™ family of Schottky rectifiers,
which offer high power density and an ultra-low forward voltage drop,
boosting output power efficiency to meet eco-design initiatives such as 80
PLUS.
|
·
|
ST
has accelerated the extension of its product range for ICs housed in
ultra-compact packages, dedicated to portable applications such as mobile
phones, displays and digital still cameras. These new packages can offer
space saving up to 80% compared to market
standards.
|
·
|
ST
gained a design win and initial orders for a turn-key Bluetooth-modem
module for industrial and consumer markets. The device includes an STM32
MCU and STLC2500 Bluetooth IC and has the world’s smallest form factor,
only 10 x 13mm.
|
·
|
ST
announced sampling to lead customers of the STM32L series – the industry’s
first ultra-low-power ARM® Cortex™-M3 microcontrollers. The STM32L series,
which combines a dedicated low-leakage 130nm process technology and an
optimized power-saving architecture to deliver industry-leading
energy-saving performance, is part of ST’s EnergyLite™ platform of
ultra-low-power products.
|
·
|
Full
production started of the STM8L ultra low-power MCU family, also featuring
ST’s EnergyLite technology to minimize power consumption in all operating
modes.
|
·
|
ST
revealed details of the new STM8T141 touch-sensor controller, which can
improve the performance and styling of mobile products. The controller
allows replacement of traditional buttons with a touch sensor for the
power-on/off control or to trigger wake-up from battery-saving sleep
modes.
|
·
|
ST
released details of the recent certification of the ST23YR80 secure dual
MCU for formal EAL6+ Common criteria certification, delivering maximum
protection for secure documents such as ID cards and biometric
passports.
|
·
|
ST,
IBM, Samsung and GLOBALFOUNDRIES announced collaboration to synchronize
manufacturing facilities for the production of advanced chips based on
28nm process technology. Fab synchronization helps ensure chip designs can
be produced at multiple sources with no redesign
required.
|
·
|
ST,
Freescale, Infineon, NXP and Bosch’s Automotive Electronics Division,
announced the formation of a consortium to jointly investigate and
standardize the acceptance of alternatives for high-lead solder for
attaching die to semiconductor packages during manufacturing. The
five-company consortium is known as the DA5 (Die Attach
5).
|
·
|
The
introduction of its T6718 feature-rich mobile-internet platform, which
enables the development of cost-effective and power-efficient multimedia
TD-HSPA handsets aimed at the Chinese
market;
|
·
|
The
expansion of its x500 family of smartphone platforms, which includes the
U8500 and U5500, to enable mobile-device manufacturers to quickly develop
a range of smartphones covering different price points and supporting
different access technologies.
|
·
|
Two
leading handset manufacturers chose ST-Ericsson’s E49xx solution for entry
phones.
|
·
|
Samsung
selected ST-Ericsson’s multimedia EDGE platform, the E4908, to underpin
its Champ (GT-C3300K) touch-screen handset, which was launched in Africa,
the Middle East, Latin America, Asia and Europe. The E4908 is a
cost-effective and highly integrated single-chip platform designed for
high-value entry devices, equipped with excellent multimedia and
connectivity features, such as a touch screen, a camera, a video player,
full-speed USB, stereo Bluetooth and FM
radio.
|
·
|
The
U6715 smartphone-for-all solution has been selected by four customers in
Asia. Some of the customers are using the U6715 solution in multiple
models.
|
·
|
ST-Ericsson’s
connectivity portfolio is gaining further momentum in Asia. The Company’s
connectivity products have been adopted by two customers as part of the
complete U8500 smartphone platform.
|
·
|
ST-Ericsson
also achieved multiple design wins for its M570 advanced modem solution,
supporting HSPA+, and the M720, supporting LTE. It announced a partnership
with Sagem Wireless for the commercial launch of multimode LTE/HSPA+
products during 2010.
|
·
|
Nokia
recently awarded ST-Ericsson a number of design-wins, selecting its HSPA+
and LTE modem solutions for new products, as well as new design wins
related to the U8500 solution.
|
|
·
|
Significant changes in demand
in the key application markets and from key customers served by our
products, which make it extremely difficult to accurately forecast and
plan our future business activities. In particular, following a period of
significant order cancellations, we are currently experiencing a strong
surge in customer demand, which has led to capacity constraints in certain
applications;
|
|
·
|
our ability to utilize and
operate our manufacturing facilities at sufficient levels to cover fixed
operating costs during periods of reduced customer demand, as well as our
ability to ramp up production efficiently and rapidly to respond to
increased customer demand, in an intensely cyclical and competitive
industry, and the financial impact of obsolete or excess inventories if
actual demand differs from our
expectations;
|
|
·
|
our ability to successfully
integrate the acquisitions we pursue, in particular the successful
integration and operation of the ST-Ericsson Wireless joint venture, which
represents a significant investment and risk for our
business;
|
|
·
|
failure by ST-Ericsson to
complete its on-going restructuring initiatives or to successfully compete
in a rapidly changing market moving from hardware to more software-driven
technology solutions, which may result in significant additional
impairment and restructuring
charges;
|
|
·
|
our ability to compete in the
semiconductor industry since a high percentage of our costs are fixed and
are incurred in currencies other than U.S. dollars, especially in
light of the volatility in the foreign exchange markets and, more
particularly, in the U.S. dollar exchange rate as compared to the
other major currencies we use for our
operations;
|
|
·
|
the outcome of ongoing
litigation as well as any new litigation to which we may become a
defendant;
|
|
·
|
changes in our overall tax
position as a result of changes in tax laws or the outcome of tax audits,
and our ability to accurately estimate tax credits, benefits, deductions
and provisions and to realize deferred tax
assets;
|
|
·
|
the impact of intellectual
property (“IP”) claims by our competitors or other third parties, and our
ability to obtain required licenses on reasonable terms and
conditions;
|
|
·
|
product warranty or liability
claims based on epidemic failures or recalls by our customers for a
product containing one of our
parts;
|
|
·
|
our ability in an intensively
competitive environment to secure customer acceptance and to achieve our
pricing expectations for high-volume supplies of new products in whose
development we have been, or are currently,
investing;
|
|
·
|
availability and costs of raw
materials, utilities, third-party manufacturing services, or other
supplies required by our operations;
and
|
|
·
|
changes in the political,
social or economic environment, including as a result of military
conflict, social unrest and/or terrorist activities, economic turmoil, as
well as natural events such as severe weather, health risks, epidemics,
earthquakes, volcano eruptions or other acts of nature in, or affecting,
the countries in which we, our key customers or our suppliers,
operate.
|
Q2
2010
(US$
millions and cents per share)
|
Gross
Profit
|
Operating
Income (Loss) |
Net
Earnings
(Loss)
|
Corresponding
EPS (diluted) |
U.S.
GAAP
|
968
|
91
|
356
|
0.39
|
Impairment
& Restructuring
|
12
|
8
|
||
Equity
Investment Divestiture
|
(265)
|
|||
Estimated
Income Tax Effect
|
60
|
|||
Non-U.S
GAAP
|
968
|
103
|
159
|
0.18
|
Q1
2010
(US$
millions and cents per share)
|
Gross
Profit
|
Operating
Income (Loss) |
Net
Earnings
(Loss)
|
Corresponding
EPS (diluted) |
U.S.
GAAP
|
876
|
(20)
|
57
|
0.06
|
Impairment
& Restructuring
|
33
|
20
|
||
Estimated
Income Tax Effect
|
(15)
|
|||
Non-U.S
GAAP
|
876
|
13
|
62
|
0.07
|
Q2
2009
(US$
millions and cents per share)
|
Gross
Profit
|
Operating
Income (Loss) |
Net
Earnings
(Loss)
|
Corresponding
EPS |
U.S.
GAAP
|
520
|
(428)
|
(318)
|
(0.36)
|
Impairment
& Restructuring
|
86
|
74
|
||
Other-Than-Temporary-Impairment
|
13
|
|||
Estimated
Income Tax Effect
|
(12)
|
|||
Non-U.S
GAAP
|
520
|
(342)
|
(243)
|
(0.28)
|
Net
Financial Position (in US$ millions)
|
June
26,
2010
|
March
27,
2010 |
June
27,
2009
|
Cash
and cash equivalents, net of bank overdrafts
|
1,268
|
1,423
|
1,685
|
Marketable
securities, current (a)
|
1,094
|
1,037
|
759
|
Short-term
deposits
|
62
|
0
|
0
|
Restricted
cash
|
250
|
250
|
250
|
Marketable
securities, non-current (a)
|
57
|
47
|
170
|
Total
financial resources
|
2,731
|
2,757
|
2,864
|
Current
portion of long-term debt
|
(802)
|
(904)
|
(174)
|
Long-term
debt
|
(1,227)
|
(1,287)
|
(2,485)
|
Total
financial debt
|
(2,029)
|
(2,191)
|
(2,659)
|
Net
financial position
|
702
|
566
|
205
|
Net
Operating Cash Flow (in US$ millions)
|
Q2
2010
|
Q1
2010
|
Q2
2009
|
Net
cash from (used in) operating activities
|
361
|
393
|
156
|
Net
cash from (used in) investing activities
|
(300)
|
(245)
|
111
|
Payment
for purchases of (proceeds) from sale of current and non-current
marketable securities and short-term deposits, net
|
151
|
28
|
(251)
|
Net
operating cash flow
|
212
|
176
|
16
|
Net
operating cash flow (ex M&A)
|
212
|
176
|
45
|
As
at
|
June
26,
|
March
27,
|
December
31,
|
|||||||||
In
million of U.S. dollars
|
2010
|
2010
|
2009
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Audited)
|
||||||||||
ASSETS
|
||||||||||||
Current
assets:
|
||||||||||||
Cash
and cash equivalents
|
1,268 | 1,423 | 1,588 | |||||||||
Restricted
cash
|
250 | - | - | |||||||||
Short-term
deposits
|
62 | - | - | |||||||||
Marketable
securities
|
1,557 | 1,037 | 1,032 | |||||||||
Subordinated
notes
|
78 | - | - | |||||||||
Trade
accounts receivable, net
|
1,442 | 1,426 | 1,367 | |||||||||
Inventories,
net
|
1,302 | 1,265 | 1,275 | |||||||||
Deferred
tax assets
|
177 | 216 | 298 | |||||||||
Assets
held for sale
|
29 | 30 | 31 | |||||||||
Other
receivables and assets
|
651 | 628 | 753 | |||||||||
Total
current assets
|
6,816 | 6,025 | 6,344 | |||||||||
Goodwill
|
1,041 | 1,055 | 1,071 | |||||||||
Other
intangible assets, net
|
771 | 810 | 819 | |||||||||
Property,
plant and equipment, net
|
3,618 | 3,802 | 4,081 | |||||||||
Long-term
deferred tax assets
|
414 | 422 | 333 | |||||||||
Equity
investments
|
66 | 267 | 273 | |||||||||
Restricted
cash
|
0 | 250 | 250 | |||||||||
Non-current
marketable securities
|
246 | 47 | 42 | |||||||||
Other
investments and other non-current assets
|
300 | 471 | 442 | |||||||||
6,456 | 7,124 | 7,311 | ||||||||||
Total
assets
|
13,272 | 13,149 | 13,655 | |||||||||
LIABILITIES
AND SHAREHOLDERS' EQUITY
|
||||||||||||
Current
liabilities:
|
||||||||||||
Current
portion of long-term debt
|
802 | 904 | 176 | |||||||||
Trade
accounts payable
|
1,346 | 1,065 | 883 | |||||||||
Other
payables and accrued liabilities
|
1,197 | 1,064 | 1,049 | |||||||||
Dividends
payable to shareholders
|
185 | - | 26 | |||||||||
Deferred
tax liabilities
|
10 | 7 | 20 | |||||||||
Accrued
income tax
|
124 | 126 | 126 | |||||||||
Total
current liabilities
|
3,664 | 3,166 | 2,280 | |||||||||
Long-term
debt
|
1,227 | 1,287 | 2,316 | |||||||||
Reserve
for pension and termination indemnities
|
280 | 300 | 317 | |||||||||
Long-term
deferred tax liabilities
|
21 | 25 | 37 | |||||||||
Other
non-current liabilities
|
239 | 334 | 342 | |||||||||
1,767 | 1,946 | 3,012 | ||||||||||
Total
liabilities
|
5,431 | 5,112 | 5,292 | |||||||||
Commitment
and contingencies
|
||||||||||||
Equity
|
||||||||||||
Parent
company shareholders' equity
|
||||||||||||
Common
stock (preferred stock:
540,000,000 shares authorized, not
issued;
|
1,156 | 1,156 | 1,156 | |||||||||
common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,339,305 shares
|
||||||||||||
issued,
881,251,879 shares outstanding)
|
||||||||||||
Capital
surplus
|
2,497 | 2,489 | 2,481 | |||||||||
Accumulated
result
|
2,828 | 2,778 | 2,723 | |||||||||
Accumulated
other comprehensive income
|
627 | 860 | 1,164 | |||||||||
Treasury
stock
|
(308 | ) | (375 | ) | (377 | ) | ||||||
Total
parent company shareholders' equity
|
6,800 | 6,908 | 7,147 | |||||||||
Noncontrolling
interest
|
1,041 | 1,129 | 1,216 | |||||||||
Total
equity
|
7,841 | 8,037 | 8,363 | |||||||||
Total
liabilities and equity
|
13,272 | 13,149 | 13,655 |
SELECTED
CASH FLOW DATA
|
Cash
Flow Data (in US$ millions)
|
Q2 2010 | Q1 2010 | Q2 2009 | |||||||||
Net
Cash from operating activities
|
361 | 393 | 156 | |||||||||
Net
Cash from (used in) investing activities
|
(300 | ) | (245 | ) | 111 | |||||||
Net
Cash used in financing activities
|
(167 | ) | (264 | ) | (71 | ) | ||||||
Net
Cash increase (decrease)
|
(155 | ) | (165 | ) | 205 | |||||||
Selected
Cash Flow Data (in US$ millions)
|
Q2 2010 | Q1 2010 | Q2 2009 | |||||||||
Depreciation
& amortization
|
309 | 310 | 335 | |||||||||
Payment
for Capital expenditures
|
(134 | ) | (179 | ) | (74 | ) | ||||||
Dividends
paid to shareholders
|
(62 | ) | (26 | ) | (34 | ) | ||||||
Change
in inventories, net
|
(75 | ) | (28 | ) | 245 |
Three
Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
June
26,
|
June
27,
|
|||||||
2010
|
2009
|
|||||||
Net
sales
|
2,507 | 1,970 | ||||||
Other
revenues
|
24 | 23 | ||||||
NET
REVENUES
|
2,531 | 1,993 | ||||||
Cost of
sales
|
(1,563 | ) | (1,473 | ) | ||||
GROSS
PROFIT
|
968 | 520 | ||||||
Selling,
general and administrative
|
(302 | ) | (286 | ) | ||||
Research and
development
|
(593 | ) | (610 | ) | ||||
Other income
and expenses, net
|
30 | 34 | ||||||
Impairment,
restructuring charges and other related closure costs
|
(12 | ) | (86 | ) | ||||
Total
Operating Expenses
|
(877 | ) | (948 | ) | ||||
OPERATING
INCOME (LOSS)
|
91 | (428 | ) | |||||
Oher-than-temporary
impairment charge on financial assets
|
- | (13 | ) | |||||
Interest
income, net
|
1 | 1 | ||||||
Loss on
equity investments and gain on investment divestiture
|
264 | (49 | ) | |||||
Loss on
financial instruments, net
|
(8 | ) | - | |||||
INCOME
(LOSS) BEFORE INCOME TAXES
|
348 | (489 | ) | |||||
AND
NONCONTROLLING INTEREST
|
||||||||
Income tax
benefit (expense)
|
(66 | ) | 62 | |||||
INCOME
(LOSS) BEFORE NONCONTROLLING INTEREST
|
282 | (427 | ) | |||||
Net loss
attributable to noncontrolling interest
|
74 | 109 | ||||||
NET
INCOME (LOSS) ATTRIBUTABLE TO PARENT COMPANY
|
356 | (318 | ) | |||||
EARNINGS
(LOSS) PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.40 | (0.36 | ) | |||||
EARNINGS
(LOSS) PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.39 | (0.36 | ) | |||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
912.1 | 876.6 | ||||||
DILUTED
EARNINGS (LOSS) PER SHARE
|
Six
months ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
June
26,
|
June
27,
|
|||||||
2010
|
2009
|
|||||||
Net
sales
|
4,818 | 3,627 | ||||||
Other
revenues
|
38 | 26 | ||||||
NET
REVENUES
|
4,856 | 3,653 | ||||||
Cost of
sales
|
(3,011 | ) | (2,696 | ) | ||||
GROSS
PROFIT
|
1,845 | 957 | ||||||
Selling,
general and administrative
|
(583 | ) | (566 | ) | ||||
Research and
development
|
(1,189 | ) | (1,168 | ) | ||||
Other income
and expenses, net
|
43 | 98 | ||||||
Impairment,
restructuring charges and other related closure costs
|
(45 | ) | (142 | ) | ||||
Total
Operating Expenses
|
(1,774 | ) | (1,778 | ) | ||||
OPERATING
INCOME (LOSS)
|
71 | (821 | ) | |||||
Oher-than-temporary
impairment charge on financial assets
|
- | (72 | ) | |||||
Interest
income, net
|
4 | 2 | ||||||
Loss on
equity investments and gain on investment divestiture
|
259 | (281 | ) | |||||
Loss on
financial instruments, net
|
(11 | ) | (8 | ) | ||||
INCOME
(LOSS) BEFORE INCOME TAXES
|
323 | (1,180 | ) | |||||
AND
NONCONTROLLING INTEREST
|
||||||||
Income tax
benefit (expense)
|
(55 | ) | 157 | |||||
INCOME
(LOSS) BEFORE NONCONTROLLING INTEREST
|
268 | (1,023 | ) | |||||
Net loss
attributable to noncontrolling interest
|
145 | 163 | ||||||
NET
INCOME (LOSS) ATTRIBUTABLE TO PARENT COMPANY
|
413 | (860 | ) | |||||
EARNINGS
(LOSS) PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.47 | (0.98 | ) | |||||
EARNINGS
(LOSS) PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.46 | (0.98 | ) | |||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
913.2 | 875.5 | ||||||
DILUTED
EARNINGS (LOSS) PER SHARE
|
STMicroelectronics
N.V.
|
|||
Date:
July 23, 2010
|
By:
|
/s/ Carlo
Ferro
|
|
Name:
|
Carlo
Ferro
|
||
Title:
|
Executive
Vice President and
Chief
Financial Officer
|