o
|
REGISTRATION
STATEMENT PURSUANT TO SECTION 12(b) OR (g) OF THE SECURITIES
EXCHANGE ACT
OF 1934
|
x
|
ANNUAL
REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE
ACT OF
1934
|
|
For
the fiscal year ended December 31,
2006
|
o
|
TRANSITION
REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE
ACT OF
1934
|
|
For
the transition period from ________________ to
________________
|
Title
of each class
|
Name
of each exchange on which registered
|
Ordinary
Shares, par value $0.0001 per ordinary share
|
The
Nasdaq Global Market Inc.*
|
*
|
Not
for trading, but only in connection with the listing on the NASDAQ
Global
Market, Inc. of American Depositary Shares representing such
Ordinary
Shares
|
Large accelerated filer o | Accelerated filer o | Non-accelerated filer x |
Page
|
|
SPECIAL
NOTE REGARDING FORWARD-LOOKING STATEMENTS
|
1
|
CERTAIN
CONVENTIONS
|
1
|
PART
I
|
3
|
ITEM
1. IDENTITY OF DIRECTORS, SENIOR MANAGEMENT AND ADVISERS
|
3
|
ITEM
2. OFFER STATISTICS AND EXPECTED TIMETABLE
|
3
|
ITEM
3. KEY INFORMATION
|
3
|
3.A.
Selected Financial Data
|
3
|
3.B.
Capitalization and Indebtedness
|
5
|
3.C.
Reason for the Offer and Use of Proceeds
|
5
|
3.D.
Risk Factors
|
5
|
ITEM
4. INFORMATION ON THE COMPANY
|
25
|
4.A.
History and Development of the Company
|
25
|
4.B.
Business Overview
|
26
|
4.C.
Organizational Structure
|
40
|
4.D.
Property, Plants and Equipment
|
42
|
ITEM
4A. UNRESOLVED STAFF COMMENTS
|
42
|
ITEM
5. OPERATING AND FINANCIAL REVIEW AND PROSPECTS
|
42
|
5.A.
Operating Results
|
42
|
5.B.
Liquidity and Capital Resources
|
55
|
5.C.
Research and Development
|
57
|
5.D.
Trend Information
|
57
|
5.E.
Off-Balance Sheet Arrangements
|
57
|
5.F.
Tabular Disclosure of Contractual Obligations
|
57
|
ITEM
6. DIRECTORS, SENIOR MANAGEMENT AND EMPLOYEES
|
60
|
6.A.
Directors and Senior Management
|
60
|
6.B.
Compensation of Directors and Executive Officers
|
62
|
6.C.
Board Practices
|
62
|
6.D.
Employees
|
65
|
6.E.
Share Ownership
|
67
|
ITEM
7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS
|
68
|
7.A.
Major Shareholders
|
68
|
7.B.
Related Party Transactions
|
69
|
7.C.
Interests of Experts and Counsel
|
70
|
ITEM
8. FINANCIAL INFORMATION
|
70
|
8.A.
Consolidated Statements and Other Financial Information
|
70
|
8.A.7.
Litigation
|
70
|
8.A.8.
Dividends and Dividend Policy
|
70
|
8.B.
Significant Changes
|
71
|
ITEM
9. THE OFFER AND LISTING
|
71
|
9.A.
Offering and Listing Details
|
71
|
9.B.
Plan of Distribution
|
72
|
9.C.
Markets
|
72
|
9.D.
Selling Shareholders
|
73
|
9.E.
Dilution
|
73
|
9.F.
Expenses of the Issue
|
73
|
ITEM
10. ADDITIONAL INFORMATION
|
73
|
10.A.
Share Capital
|
73
|
10.B.
Memorandum and Articles of Association
|
73
|
10.C.
Material Contracts
|
73
|
10.D.
Exchange Controls
|
73
|
10.E.
Taxation
|
73
|
10.F.
Dividends and Paying Agents
|
76
|
10.G.
Statement by Experts
|
76
|
10.H.
Documents on Display
|
76
|
10.I.
Subsidiary Information
|
76
|
ITEM
11. QUANTITATIVE AND QUALITATIVE DISCLOSURES ABOUT MARKET
RISK
|
76
|
ITEM
12. DESCRIPTION OF SECURITIES OTHER THAN EQUITY SECURITIES
|
76
|
PART
II
|
77
|
ITEM
13. DEFAULTS, DIVIDEND ARREARAGES AND DELINQUENCIES
|
77
|
ITEM
14. MATERIAL MODIFICATIONS TO THE RIGHTS OF SECURITY HOLDERS AND
USE OF
PROCEEDS
|
77
|
ITEM
15. CONTROLS AND PROCEDURES
|
77
|
ITEM
16A. AUDIT COMMITTEE FINANCIAL EXPERT
|
78
|
ITEM
16B. CODE OF ETHICS
|
78
|
ITEM
16C. PRINCIPAL ACCOUNTANT FEES AND SERVICES
|
78
|
ITEM
16D. EXEMPTIONS FROM THE LISTING STANDARDS FOR AUDIT
COMMITTEES
|
79
|
ITEM
16E. PURCHASES OF EQUITY SECURITIES BY THE ISSUER AND AFFILIATED
PURCHASERS
|
79
|
PART
III
|
79
|
ITEM
17. FINANCIAL STATEMENTS
|
79
|
ITEM
18. FINANCIAL STATEMENTS
|
79
|
ITEM
19. EXHIBITS
|
81
|
Year
Ended December 31,
|
||||||||||||||||||||
2002
|
2003
|
2004
|
2005
|
2006
|
||||||||||||||||
(in
thousands, except per share data)
|
||||||||||||||||||||
Consolidated
Statements of Income Data:
|
||||||||||||||||||||
Revenues,
net
|
$ |
56,478
|
$ |
131,843
|
$ |
300,273
|
$ |
540,204
|
$ |
744,518
|
||||||||||
Costs
and expenses(1):
|
||||||||||||||||||||
Cost
of revenues
|
45,313
|
100,102
|
235,973
|
419,380
|
601,565
|
|||||||||||||||
Research
and development
|
7,800
|
21,077
|
24,021
|
41,278
|
60,655
|
|||||||||||||||
General
and administrative
|
1,489
|
4,614
|
4,654
|
6,784
|
9,762
|
|||||||||||||||
Sales
and marketing
|
884
|
2,669
|
2,742
|
4,762
|
6,970
|
|||||||||||||||
Operating
income
|
992
|
3,381
|
32,883
|
68,000
|
65,566
|
|||||||||||||||
Net
income (loss)(2)
|
$ |
513
|
$ | (581 | ) | $ |
36,000
|
$ |
61,558
|
$ |
75,190
|
|||||||||
Earnings
(loss) per ordinary share(2) and per ADS(3):
|
||||||||||||||||||||
Basic
|
$ |
0.00
|
$ | (0.00 | ) | $ |
0.21
|
$ |
0.35
|
$ |
0.39
|
|||||||||
Diluted
|
$ |
0.00
|
$ | (0.00 | ) | $ |
0.21
|
$ |
0.34
|
$ |
0.39
|
|||||||||
Weighted-average
number of shares used in earnings per share computation:
|
||||||||||||||||||||
Basic
|
103,276
|
116,617
|
169,320
|
176,105
|
192,475
|
|||||||||||||||
Diluted
|
104,739
|
116,617
|
173,298
|
180,659
|
195,090
|
Year
Ended December 31,
|
||||||||||||||||||||
2002
|
2003
|
2004
|
2005
|
2006
|
||||||||||||||||
(in
thousands, except per share data)
|
||||||||||||||||||||
Cash
dividends declared per ordinary share(4)
|
$ |
0.00
|
$ |
0.00
|
$ |
0.00
|
$ |
0.08
|
$ |
0.00
|
Note:
|
(1)
|
The
amount of share-based compensation included in applicable costs and
expenses categories is summarized as
follows:
|
Year
Ended December 31,
|
||||||||||||||||||||
2002
|
2003
|
2004
|
2005
|
2006
|
||||||||||||||||
(in
thousands)
|
||||||||||||||||||||
Cost
of revenues
|
$ |
172
|
$ |
827
|
$ |
291
|
$ |
188
|
$ |
275
|
||||||||||
Research
and development
|
3,057
|
11,666
|
4,288
|
6,336
|
11,806
|
|||||||||||||||
General
and administrative
|
353
|
2,124
|
721
|
848
|
1,444
|
|||||||||||||||
Sales
and marketing
|
348
|
1,349
|
537
|
1,241
|
1,625
|
|||||||||||||||
Total
|
$ |
3,930
|
$ |
15,966
|
$ |
5,837
|
$ |
8,613
|
$ |
15,150
|
||||||||||
(2)
|
Under
the ROC Statute for Upgrading Industries, we are exempt from income
taxes
for income attributable to expanded production capacity or newly
developed
technologies. If we had not been exempt from paying this income tax,
net
income and basic and diluted earnings per share would have been $29.7
million, $0.18 and $0.17, respectively, for the year ended December
31,
2004, $52.4 million, $0.30 and $0.29, respectively, for the year
ended
December 31, 2005 and $59.2 million, $0.31 and $0.30, respectively,
for
the year ended December 31, 2006. A portion of this tax
exemption expires on March 31, 2009 and the remainder on December
31,
2010.
|
(3)
|
Each
ADS represents one ordinary share.
|
(4)
|
In
November 2005, we distributed a special cash dividend of approximately
$0.08 per share in respect of our performance prior to our initial
public
offering. This special cash dividend should not be considered
representative of the dividends that would be paid in any future
periods
or our dividend policy.
|
As
of December 31,
|
||||||||||||||||||||
2002
|
2003
|
2004
|
2005
|
2006
|
||||||||||||||||
(in
thousands)
|
||||||||||||||||||||
Consolidated
Balance Sheet Data:
|
||||||||||||||||||||
Cash
and cash equivalents(1)
|
$ |
2,697
|
$ |
2,529
|
$ |
5,577
|
$ |
7,086
|
$ |
109,753
|
||||||||||
Accounts
receivable, net
|
1,637
|
12,543
|
27,016
|
80,259
|
112,767
|
|||||||||||||||
Accounts
receivable from related parties, net
|
4,786
|
22,893
|
39,129
|
69,587
|
116,850
|
|||||||||||||||
Inventories
|
12,056
|
21,088
|
54,092
|
105,004
|
101,341
|
|||||||||||||||
Total
current assets
|
26,885
|
88,245
|
144,414
|
300,056
|
466,715
|
|||||||||||||||
Total
assets
|
29,423
|
96,159
|
157,770
|
327,239
|
518,794
|
|||||||||||||||
Accounts
payable
|
5,803
|
22,901
|
38,649
|
105,801
|
120,407
|
|||||||||||||||
Total
current liabilities
|
11,750
|
43,613
|
52,157
|
160,784
|
153,279
|
|||||||||||||||
Total
liabilities
|
11,975
|
43,870
|
52,246
|
160,784
|
153,471
|
|||||||||||||||
Ordinary
Shares
|
11
|
17
|
18
|
18
|
19
|
|||||||||||||||
Total
stockholders’ equity (5)
|
17,448
|
52,289
|
104,860
|
165,831
|
363,927
|
|||||||||||||||
Consolidated
Cash Flow Data:
|
||||||||||||||||||||
Net
cash provided by (used in) operating activities
|
(3,884 | ) | (1,593 | ) | (8,688 | ) |
12,464
|
29,696
|
||||||||||||
Net
cash provided by (used in) investing activities
|
(7,130 | ) | (28,915 | ) |
11,001
|
(25,363 | ) | (8,927 | ) | |||||||||||
Net
cash provided by financing activities
|
11,644
|
30,341
|
735
|
14,404
|
81,886
|
|||||||||||||||
Effect
of exchange rate changes on cash and cash equivalents
|
-
|
-
|
-
|
4
|
12
|
As
of December 31,
|
||||||||||||||||||||
2002
|
2003
|
2004
|
2005
|
2006
|
||||||||||||||||
(in
thousands)
|
||||||||||||||||||||
Net
increase (decrease) in cash and cash equivalents
|
630
|
(167 | ) |
3,048
|
1,509
|
102,667
|
Note:
|
(1)
|
Cash
and cash equivalents at December 31, 2006 increased significantly
as
compared to December 31, 2005. This increase was primarily due
to net
proceeds of $147.4 million received from our initial public offering
in
April 2006 which also caused the increase in our stockholders
equity by
the same amount.
|
Noon
Buying Rate
|
||||||||||||||||
Average(1)
|
High
|
Low
|
Period-end
|
|||||||||||||
(NT
dollars per U.S. dollar)
|
||||||||||||||||
Period
|
||||||||||||||||
2002
|
34.54
|
35.16
|
32.85
|
34.70
|
||||||||||||
2003
|
34.40
|
34.98
|
33.72
|
33.99
|
||||||||||||
2004
|
33.37
|
34.16
|
31.74
|
31.74
|
||||||||||||
2005
|
32.13
|
33.77
|
30.65
|
32.80
|
||||||||||||
2006
|
32.51
|
33.31
|
31.28
|
32.59
|
||||||||||||
First
quarter
|
32.28
|
32.65
|
31.83
|
32.42
|
||||||||||||
Second
quarter
|
32.15
|
32.70
|
31.28
|
32.33
|
||||||||||||
Third
quarter
|
32.76
|
33.10
|
32.24
|
33.10
|
||||||||||||
Fourth
quarter
|
32.84
|
33.31
|
32.27
|
32.59
|
||||||||||||
2007
|
||||||||||||||||
January
|
32.77
|
32.99
|
32.38
|
32.95
|
||||||||||||
February
|
32.97
|
33.08
|
32.86
|
32.98
|
||||||||||||
March
|
33.01
|
33.13
|
32.84
|
33.01
|
||||||||||||
April
|
33.15
|
33.33
|
33.05
|
33.33
|
||||||||||||
May
|
33.28
|
33.41
|
32.97
|
33.09
|
||||||||||||
June
(through June 18)
|
33.05
|
33.18
|
32.98
|
33.17
|
Note: (1)
|
Determined by averaging the rates on each business
day.
|
|
·
|
maintain
our profitability;
|
|
·
|
preserve
our position in the large-sized panel display driver
market;
|
|
·
|
acquire
and retain customers;
|
|
·
|
secure
satisfactory performance from our semiconductor manufacturing service
providers;
|
|
·
|
diversify
our revenue sources by successfully developing, designing and selling
products other than large-sized panel display
drivers;
|
|
·
|
develop
display drivers with more advanced features and for use in different
applications;
|
|
·
|
attract,
train, motivate and retain qualified
personnel;
|
|
·
|
keep
up with evolving industry standards and market
developments;
|
|
·
|
manage
our expanding operations and product offerings, including our recent
acquisition of Wisepal Technologies, Inc., or Wisepal, and the integration
of any future acquisitions;
|
|
·
|
raise
our brand recognition, maintain and enhance our reputation and develop
customer loyalty;
|
|
·
|
anticipate
and adapt to any changes in government regulations, mergers and
acquisitions involving our competitors, technological developments
and
other significant competitive and market
dynamics;
|
|
·
|
maintain
adequate control of our expenses;
or
|
|
·
|
manage
risks relating to intellectual property rights, including the protection
of our proprietary technologies.
|
|
·
|
hire,
train, integrate and manage additional qualified engineers, senior
managers, sales and marketing personnel and information technology
personnel;
|
|
·
|
implement
additional, and improve existing, administrative and operations systems,
procedures and controls;
|
|
·
|
expand
our accounting and internal audit team, including hiring additional
personnel with U.S. GAAP and internal control
expertise;
|
|
·
|
continue
to expand and upgrade our design and product development
capabilities;
|
|
·
|
manage
multiple relationships with semiconductor manufacturing service providers,
customers, suppliers and certain other third parties;
and
|
|
·
|
manage
our financial condition.
|
|
·
|
our
ability to successfully design, develop and introduce in a timely
manner
new or enhanced products acceptable to our
customers;
|
|
·
|
changes
in the relative mix in the unit shipments of our products, which
have
significantly different average selling prices and cost of revenues
as a
percentage of revenues;
|
|
·
|
the
loss of one or more of our key
customers;
|
|
·
|
decreases
in the average selling prices of our
products;
|
|
·
|
our
accumulation of inventory;
|
|
·
|
the
relative unpredictability in the volume and timing of customer
orders;
|
|
·
|
the
risk of cancellation or deferral of customer orders in anticipation
of our
new products or product enhancements, or due to a reduction in our
customers’ end demand;
|
|
·
|
changes
in the availability of capacity of semiconductor manufacturing service
providers;
|
|
·
|
the
rate at which new markets emerge for new products under
development;
|
|
·
|
the
evolution of industry standards and
technologies;
|
|
·
|
product
obsolescence and our ability to manage product
transitions;
|
|
·
|
our
involvement in litigation or other types of
disputes;
|
|
·
|
general
economic conditions; and
|
|
·
|
natural
disasters, particularly earthquakes and typhoons, or disease outbreaks
affecting countries where we conduct our business or where our products
are manufactured, assembled or
tested.
|
|
·
|
a
surge in manufacturing capacity due to the ramping up of new fabrication
facilities;
|
|
·
|
manufacturers
operating at high levels of capacity utilization in order to reduce
fixed
costs per panel; and
|
|
·
|
lower-than-expected
demand for end-use products that incorporate TFT-LCD
panels.
|
|
·
|
failure
to secure necessary manufacturing capacity, or being able to obtain
required capacity only at higher
cost;
|
|
·
|
limited
control over delivery schedules, quality assurance and control,
manufacturing yields and production costs;
and
|
|
·
|
the
unavailability of, or potential delays in obtaining access to, key
process
technologies.
|
|
·
|
potential
capacity constraints faced by the limited number of high-voltage
foundries
and the lack of investment in new and existing high-voltage
foundries;
|
|
·
|
difficulty
in attaining consistently high manufacturing yields from high-voltage
foundries;
|
|
·
|
delay
and time required (approximately one year) to qualify and ramp up
production at a new high voltage foundry;
and
|
|
·
|
price
increases.
|
|
·
|
stop
selling products or using technology or manufacturing processes that
contain the allegedly infringing intellectual
property;
|
|
·
|
pay
damages to the party claiming
infringement;
|
|
·
|
attempt
to obtain a license for the relevant intellectual property, which
may not
be available on commercially reasonable terms or at all;
and
|
|
·
|
attempt
to redesign those products that contain the allegedly infringing
intellectual property with non-infringing intellectual property,
which may
not be possible.
|
|
·
|
problems
integrating the acquired operations, technologies or products into
our
existing business and products;
|
|
·
|
diversion
of management’s time and attention from our core
business;
|
|
·
|
adverse
effects on existing business relationships with
customers;
|
|
·
|
need
for financial resources above our planned investment
levels;
|
|
·
|
failures
in recognizing anticipated
synergies;
|
|
·
|
difficulties
in retaining business relationships with suppliers and customers
of the
acquired company;
|
|
·
|
risks
associated with entering markets in which we lack
experience;
|
|
·
|
potential
loss of key employees of the acquired
company;
|
|
·
|
potential
write-offs of acquired assets; and
|
|
·
|
potential
expenses related to the depreciation of tangible assets and amortization
of intangible assets.
|
|
·
|
to
purchase three hectares of land in connection with the construction
of our
new headquarters in Tainan, Taiwan;
|
|
·
|
to
increase the number of employees in Taiwan to 430 employees, 475
employees
and 520 employees by the end of 2005, 2006 and 2007, respectively;
and
|
|
·
|
to
invest no less than $24.4 million (NT$800.0 million), $27.6 million
(NT$900.0 million) and $30.7 million (NT$1.0 billion) for
research and development in Taiwan in 2005, 2006 and 2007, respectively,
which may be satisfied through cash-based compensation paid to research
and development personnel but not through non-cash share-based
compensation.
|
|
·
|
We
may face difficulties obtaining subsequent ROC Investment Commission
approvals for additional investments in Himax Taiwan, including further
equity investments such as cash or asset contributions and inter-company
loans from us.
|
|
·
|
We
may face difficulties obtaining approval from the ROC Central Bank
of
China to transfer the net proceeds of capital raising efforts to
Himax
Taiwan. Any restriction on our ability to transfer the net proceeds
of our
capital raising to Himax Taiwan would effectively limit Himax Taiwan’s
ability to access the capital markets through us since we are a holding
company with no operations and the use of proceeds for any capital
raised
by us would be for the operations of Himax Taiwan through which
substantially all of our operations are
conducted.
|
|
·
|
Himax
Taiwan may also lose its status as a foreign-invested company under
the
ROC Statute for Investment by Foreign Nationals, resulting in the
loss of
certain protections, including the protection from possible expropriation
of the company’s assets.
|
|
·
|
actual
or anticipated fluctuations in our quarterly operating
results;
|
|
·
|
changes
in financial estimates by securities research
analysts;
|
|
·
|
conditions
in TFT-LCD panel market;
|
|
·
|
changes
in the economic performance or market valuations of other display
semiconductor companies;
|
|
·
|
announcements
by us or our competitors of new products, acquisitions, strategic
partnerships, joint ventures or capital
commitments;
|
|
·
|
addition
or departure of key personnel;
|
|
·
|
fluctuations
of exchange rates between the U.S. dollar and NT
dollar;
|
|
·
|
litigation
related to our intellectual property;
and
|
|
·
|
release
of lock-up or other transfer restrictions on our outstanding ADSs
or sales
of additional ADSs.
|
|
·
|
directors
who are interested in a transaction do not have a statutory duty
to
disclose such interest and there are no provisions under Cayman Islands
Companies Law which render such director liable to the company for
any
profit realized pursuant to such
transaction;
|
|
·
|
dissenting
shareholders do not have appraisal rights if a scheme of arrangement
is
approved by the Grand Court of the Cayman
Islands;
|
|
·
|
shareholders
may not be able to bring class action or derivative action suits
before a
Cayman Islands court; and
|
|
·
|
unless
otherwise provided under the memorandum and articles of association
of the
company, shareholders do not have the right to bring business before
a
meeting or call a meeting.
|
|
·
|
Display
Driver. The display driver receives image data from the timing
controller and delivers precise analog voltages or currents to create
images on the display. The two main types of display drivers for
a TFT-LCD
panel are gate drivers and source drivers. Gate drivers turn on the
transistor within each pixel cell on the horizontal line on the panel
for
data input at each row. Source drivers receive image data from the
timing
controller and generate voltage that is applied to the liquid crystal
within each pixel cell on the vertical line on the panel for data
input at
each column. The combination determines the colors generated by each
pixel. Typically multiple gate drivers and source drivers are installed
separately on the panel. However, for certain small- and medium-sized
applications, gate drivers and source drivers are integrated into
a single
chip due to space and cost considerations. Large-sized panels typically
have higher resolution and require more display drivers than small-
and
medium-sized panels.
|
|
·
|
Timing
Controller. The timing controller receives image data and converts
the format for the source drivers’ input. The timing controller also
generates controlling signals for gate and source drivers. Typically
the
timing controller is a discrete semiconductor in large-sized TFT-LCD
panels. For certain small- and medium-sized applications, however,
the
timing controller may be integrated with display
drivers.
|
|
·
|
Scaler.
For certain displays, a scaler is installed to magnify or shrink
image
data in order for the image to fill the
panel.
|
|
·
|
Operational
Amplifier. An operational amplifier supplies the reference voltage to
source drivers in order to make their output voltage
uniform.
|
|
·
|
Television
Chipset. Television flat panel displays require chipsets that
typically contain all or some of the following components: an audio
processor, analog interfaces, digital interfaces, a video processor,
a
channel receiver and a digital television decoder. See
“—Products—Television Semiconductor Solutions—Television Chipsets” for a
description of these components.
|
|
·
|
Others.
Flat panel displays also require multiple general purpose
semiconductors such as memory, power converters and
inverters.
|
|
·
|
display
drivers and timing controllers;
|
|
·
|
television
semiconductor solutions; and
|
|
·
|
LCOS
products.
|
|
·
|
Resolution
and Number of Channels. Resolution refers to the number of pixels per
line multiplied by the number of lines, which determines the level
of fine
detail within an image displayed on a panel. For example, a color
display
screen with 1,024 x 768 pixels has 1,024 red columns, 1,024 green
columns
and 1,024 blue columns for a total of 3,072 columns and 768 rows.
The red,
green and blue columns are commonly referred to as “RGB.” Therefore, the
display drivers need to drive 3,072 column outputs and 768 row outputs.
The number of display drivers required for each panel depends on
the
resolution. For example, an XGA (1,024 x 768 pixels) panel requires
eight
384 channel source drivers (1,024 x 3 = 384 x 8) and three 256 channel
gate drivers (768 = 256 x 3), while a SXGA (1,280 x 1,024 pixels)
panel
requires ten 384 channel source drivers and four 256 channel gate
drivers.
The number of display drivers required can be reduced by using drivers
with a higher number of channels. For example, a SXGA panel can have
eight
480 channel source drivers or four 960 channel source drivers instead
of
ten 384 channel source drivers. Thus, using display drivers with
a higher
number of channels can reduce the number of display drivers required
for
each panel, although display drivers with a higher number of channels
typically have higher unit costs.
|
|
·
|
Color
Depth. Color depth is the number of colors that can be displayed on
a
screen, which is determined by the number of shades of a color, also
known
as grayscale, that can be shown by the panel. For example, a 6-bit
source
driver is capable of generating 26
x 26
x 26
= 218,
or 262K
colors, and similarly, an 8-bit source driver is capable of generating
16
million colors. Typically, for TFT-LCD panels currently in commercial
production, 262K and 16 million colors are supported by 6-bit and
8-bit
source drivers, respectively.
|
|
·
|
Operational
Voltage. A display driver operates with two voltages: the input
voltage (which enables it to receive signals from the timing controller)
and the output voltage (which, in the case of source drivers, is
applied
to liquid crystals and, in the case of gate drivers, is used to switch
on
the TFT device). Source drivers typically operate at input voltages
from
3.3 to 1.5 volts and output voltages between 10 to 18 volts. Gate
drivers typically operate at input voltages from 3.3 to 1.5 volts
and
output voltages from 10 to 45 volts. Lower input voltage saves power
and
lowers electromagnetic interference, or EMI. Output voltage may be
higher
or lower depending on the characteristics of the liquid crystal (or
diode), in the case of source drivers, or TFT device, in the case
of gate
drivers.
|
|
·
|
Gamma
Curve. The relationship between the light passing through a pixel and
the voltage applied to it by the source driver is nonlinear and is
referred to as the “gamma curve” of the source driver. Different panel
designs and manufacturing processes require source drivers with different
gamma curves. Display drivers need to adjust the gamma curve to fit
the
pixel design. Due to the materials and processes used in manufacturing,
panels may contain certain imperfections which can be corrected by
the
gamma curve of the source driver, a process which is generally known
as
“gamma correction.” For certain types of liquid crystal, the gamma curves
for RGB cells are significantly different and thus need to be
independently corrected. Some advanced display drivers feature three
independent gamma curves for RGB
cells.
|
|
·
|
Driver
Interface. Driver interface refers to the connection between the
timing controller and display drivers. Display drivers increasingly
require higher bandwidth interface technology to address the larger
data
volume necessary for video images. Panels used for higher data
transmission applications such as televisions require more advanced
interface technology. The principal types of interface technologies
are
transistor-to-transistor logic, or TTL, reduced swing differential
signaling, or RSDS, and mini low voltage differential signaling,
or
mini-LVDS. Among these, RSDS and mini-LVDS were developed as low
power,
low noise and low amplitude method for high-speed data transmission
using
fewer copper wires and resulting in lower EMI. In 2005, we introduced
two
new display driver interfaces: dual edge TTL, or DETTL, and turbo
RSDS.
DETTL enables the interface to function with lower power (below 1.8V),
thus reducing power consumption. Turbo RSDS is an upgraded version
of RSDS
which increases the interface frequency from 85MHz to 135MHz, thus
reducing the bus width and panel
costs.
|
|
·
|
Package
Type. The assembly of display drivers typically uses TAB and COG
package types. COF and TCP are two types of TAB packages. Customers
typically determine the package type required according to their
specific
mechanical and electrical considerations. In general, display drivers
for
small-sized panels use COG package type whereas display drivers for
large-sized panels primarily use TAB package types and to a lesser
extent
COG package types.
|
Product
|
Features
|
||
TFT-LCD
Source Drivers
|
• |
384
to 960 output channels
|
|
• |
6-bit
(262K colors), 8-bit (16 million colors) or 10-bit (1 billion
colors)
|
||
• |
one
gamma-type driver
|
||
• |
three
gamma-type drivers (RGB independent gamma curve to enhance color
image)
|
||
• |
output
driver voltage ranging from 4.5V to 18V
|
||
• |
input
logic voltage ranging from standard 3.3V to low power
1.5V
|
||
• |
low
power consumption and low EMI
|
||
• |
supports
TCP, COF and COG package types
|
||
• |
supports
TTL, RSDS, mini-LVDS, DETTL, turbo RSDS and customized interface
technologies
|
||
TFT-LCD
Gate Drivers
|
•
|
192
to 400 output channels
|
|
•
|
output
driving voltage ranging from 10 to 45V
|
||
•
|
input
logic voltage ranging from standard 3.3V to low power
1.5V
|
||
•
|
low
power consumption
|
||
•
|
supports
TCP, COF and COG package types
|
||
Timing
Controllers
|
•
|
product
portfolio supports a wide range of resolutions, from VGA (640
x 480 pixels) to Full HD (1,920 x 1,080 pixels)
|
|
•
|
supports
TTL, RSDS, mini-LVDS, DETTL, turbo RSDS and customized output interface
technologies
|
||
•
|
input
logic voltage ranging from standard 3.3V to low power
1.5V
|
||
•
|
embedded
overdrive function for television applications to improve response
time
|
||
•
|
supports
TTL, LVDS and mini-LVDS input interface
technologies
|
Product
|
Features
|
||
TFT-LCD
Drivers
|
•
|
highly
integrated single chip embedded with the source driver, gate driver,
power
circuit, timing controller and memory
|
|
•
|
product
portfolio suitable for a wide range of resolutions including QQVGA
(128 x
160 pixels), QCIF (132 x 176 pixels), QCIF+ (176 x 220 pixels), QVGA
(240
x 320 pixels), WQVGA (240 x 480 pixels) and a range of panel sizes
from
1.5 to 3.2 inches in diagonal measurement
|
||
•
|
supports 262K colors to 16 million colors | ||
•
|
input logic voltage ranging from standard 3.3V to low power 1.65V | ||
•
|
low power consumption and low EMI | ||
•
|
utilizes die shrink technology to reduce die size and cost | ||
•
|
slimmer die for compact module to fit smaller mobile handset designs | ||
•
|
application
specific integrated circuits, or ASIC, can be designed to meet customized
requirements (e.g. drivers without memory or drivers without gate
driver
embedded on the chip)
|
||
LTPS
Drivers
|
•
|
highly
integrated single chip embedded with the source driver, power
circuit, timing
controller and memory
|
|
•
|
supports 262K colors to 16 million colors | ||
•
|
input logic voltage ranging from standard 3.3V to low power 1.65V | ||
•
|
utilizes die shrink technology to reduce die size and cost | ||
•
|
slimmer die for compact module | ||
•
|
ASIC can be designed to meet customized requirements (e.g. gate-less or multi-bank output driver) |
Product
|
Features
|
||
TFT-LCD
Source Drivers
|
•
|
240
to 1200 output channels
|
|
•
|
products for analog and digital interfaces | ||
•
|
supports 262K colors to 16 million colors | ||
•
|
input logic voltage ranging from standard 3.3V to low power 2.5V | ||
•
|
low power consumption and low EMI | ||
TFT-LCD
Gate Drivers
|
•
|
96
to 800 output channels
|
|
•
|
input logic voltage ranging from standard 3.3V to low power 2.5V | ||
•
|
output
driving voltage ranging from 10 to 40V
|
||
TFT-LCD
Integrated Drivers
|
•
|
highly
integrated single chip embedded with source driver, gate
driver, timing
controller and power circuit
|
|
•
|
products for analog or digital interfaces | ||
Timing
Controllers
|
•
|
poducts
for analog or digital interfaces
|
|
•
|
supports
various resolutions from 280 x 220 pixels to 800 x 600
pixels
|
|
·
|
Audio
Processor/Amplifier. Demodulates, processes and amplifies sound from
television signals.
|
|
·
|
Analog
Interfaces. Convert analog video signals into digital video signals.
Video decoder and analog-to-digital converter (ADC) are
included.
|
|
·
|
Digital
Interfaces. Receive digital signals via digital receivers. Digital
visual interfaces (DVI) and high-definition multimedia interfaces
(HDMI)
are included.
|
|
·
|
Channel
Receiver. Demodulates input signals so that the output becomes
compressed bit stream data.
|
|
·
|
DTV
Decoder. Converts video and audio signals from compressed bit stream
data into regular video and audio
signals.
|
|
·
|
Video
Processor. Performs the scaling function that magnifies or shrinks
the image data in order to fit the panel’s resolution; provides real-time
processing for improved color and image quality; converts output
video
from an interlaced format to a progressive format in order to eliminate
jaggedness; and supports on-screen display and real-time video
format
transformation.
|
Product
|
Features
|
||
Analog
TV single-chip solutions
|
•
|
ideal
for LCD TV, MFM TV and LCOS applications
|
|
•
|
integrated with video decoder and 3D comb filter to support worldwide NTSC, PAL and SECAM standards | ||
•
|
integrated with VBI Slicer for CC, V-Chip and Teletext functions | ||
•
|
integrated with TCON and Over-Drive for additional cost-down | ||
•
|
integrated with high performance scaler, de-interlancer, and ADC | ||
•
|
built-in HDMI and DVI Receiver | ||
•
|
built-in
Himax 3rd generation video engine which supports variable dynamic
video
enhancement features
|
||
•
|
output resolutions range from 640 x 480 up to 1920 x 1080 |
Product
|
Features
|
||
Digital
Television Tuner Modules
|
•
|
DVB-T
tuners for 6MHz bandwidth (for use in Taiwan), 7MHz bandwidth (for
use in
Australia) and 8MHz bandwidth (for use in Europe)
|
|
•
|
ATSC RF tuners with NTSC function | ||
•
|
lower power RF tuners | ||
Analog
Television Tuner Modules
|
•
|
global
tuner combining NTSC, PAL and SECAM television standards and FM
radio
tuner
|
|
•
|
low power off-air tuner combining NTSC and PAL television standards and FM radio tuner | ||
•
|
mobile analog tuner combining NTSC television standards and FM radio tuner | ||
•
|
slim design to save space |
Product
|
Features
|
||
LCOS
Modules for Near-to-eye, Mini- and
|
•
|
640
x 360 pixels (Q720P), VGA and SVGA resolutions
|
|
Mobile-projector
Applications
|
•
|
8-bit (16 million colors) | |
•
|
high reflectivity and greater than 100:1 contrast ratio | ||
•
|
low power consumption | ||
LCOS
Modules for Projection Applications
|
•
|
WXGA
and Full HD resolutions
|
|
•
|
8-bit
(16 million colors)
|
||
•
|
high reflectivity and greater than 1,000:1 contrast ratio |
|
·
|
Inner-Lead
Bonding: The TCP and COF assembly process
involves grinding the bumped wafers into their required thickness
and
cutting the wafers into individual dies, or chips. An inner lead
bonder
machine connects the chip to the printed circuit processed tape
and the
package is sealed with resin at high
temperatures.
|
|
·
|
Final
Testing: The assembled display drivers are
tested to ensure that they meet performance specifications. Testing
takes
place on specialized equipment using software customized for each
product.
|
Wafer
Fabrication
|
Gold
Bumping
|
Chartered
Semiconductor Manufacturing Ltd.
|
Chipbond
Technology Corporation
|
Lite-on
Semiconductor Corp.
|
ChipMOS
Technologies Inc.
|
Macronix
International Co., Ltd.
|
International
Semiconductor Technology Ltd.
|
Powerchip
Semiconductor Corp.
|
|
Taiwan
Semiconductor Manufacturing Company
|
|
United
Microelectronics Corporation
|
|
Vanguard
International Semiconductor Corporation
|
Processed
Tape for TAB Packaging
|
Assembly
and Testing
|
CASIO
Micronics Co., Ltd.
|
Chipbond
Technology Corporation
|
Hitachi
Cable, Ltd.
|
ChipMOS
Technologies Inc.
|
Mitsui
Mining & Smelting Co., Ltd.
|
International
Semiconductor Technology Ltd.
|
Samsung
Techwin Co. Ltd.
|
Siliconware
Precision Industries Co., Ltd.
|
Stemco.,
Ltd
|
|
Sumitomo
Metal Mining Package Material Co., Ltd.
|
Chip
Probe Testing
|
|
Ardentec
Corporation
|
|
Chipbond
Technology Corporation
|
|
ChipMOS
Technologies Inc.
|
|
International
Semiconductor Technology Ltd.
|
|
King
Yuan Electronics Co., Ltd
|
|
Siliconware
Precision Industries Co., Ltd.
|
|
·
|
customer
relations;
|
|
·
|
product
performance;
|
|
·
|
design
customization;
|
|
·
|
development
time;
|
|
·
|
product
integration;
|
|
·
|
technical
services;
|
|
·
|
manufacturing
costs;
|
|
·
|
supply
chain management;
|
|
·
|
economies
of scale; and
|
|
·
|
broad
product portfolio.
|
Subsidiary
|
Main Activities
|
Jurisdiction of
Incorporation
|
Total Paid-in
Capital
|
Percentage of
Our Ownership
Interest
|
||||
$(in
millions)
|
||||||||
Himax
Technologies Limited
|
IC
design and sales
|
ROC
|
55.3
|
100%
|
||||
Himax
Technologies Anyang Limited
|
Sales
|
South
Korea
|
0.5
|
100%
|
||||
Wisepal
Technologies, Inc.
|
IC
design and sales
|
ROC
|
9.9
|
100%
|
||||
Himax
Technologies (Samoa), Inc.
|
Investments
|
Samoa
|
2.3
|
100%(1)
|
||||
Himax
Technologies (Suzhou) Co., Ltd.
|
Sales
|
PRC
|
1.0
|
100%(1)
|
||||
Himax
Technologies (Shenzhen) Co., Ltd.
|
Sales
|
PRC
|
0.5
|
100%(1)
|
||||
Himax
Display, Inc.
|
IC
design, manufacturing and sales
|
ROC
|
18.2
|
87.5%
|
||||
Integrated
Microdisplays Limited
|
IC
design and sales
|
Hong
Kong
|
0.6
|
100%(2)
|
Subsidiary
|
Main Activities
|
Jurisdiction of
Incorporation
|
Total Paid-in
Capital
|
Percentage of
Our Ownership
Interest
|
||||
$(in
millions)
|
||||||||
Himax
Analogic, Inc. (formerly Amazion Electronics, Inc.)
|
IC
design and sales
|
ROC
|
4.1
|
86.3%
|
||||
Himax
Imaging, Inc.
|
Investments
|
Cayman
|
5.5
|
100%
|
||||
Himax
Imaging Ltd.
|
IC
design and sales
|
ROC
|
2.1
|
100%
|
||||
Himax
Imaging Corp.
|
IC
design and sales
|
California,
USA
|
2.5
|
100%
|
|
·
|
average
selling prices;
|
|
·
|
unit
shipments;
|
|
·
|
product
mix;
|
|
·
|
design
wins;
|
|
·
|
cost
of revenues and cost reductions;
|
|
·
|
supply
chain management;
|
|
·
|
share-based
compensation expenses; and
|
|
·
|
signing
bonuses.
|
|
·
|
introduce
new models to improve the cost and/or performance of their existing
products or to expand their product
portfolio;
|
|
·
|
establish
new fabs and seek to qualify existing or new components suppliers;
and
|
|
·
|
replace
existing display driver companies due to cost or performance
reasons.
|
|
·
|
improving
product design (e.g., having smaller die size allows for a larger
number
of dies on each wafer, thereby reducing the cost of each
die);
|
|
·
|
improving
manufacturing yields through our close collaboration with our
semiconductor manufacturing service providers;
and
|
|
·
|
achieving
better pricing from semiconductor manufacturing service providers
and
suppliers, reflecting our ability to leverage our scale, volume
requirements and close relationships as well as our strategy of
sourcing
from multiple service providers and
suppliers.
|
Year
Ended December 31,
|
||||||||||||||||||||||||
2004
|
2005
|
2006
|
||||||||||||||||||||||
Amount
|
Percentage of
Revenues
|
Amount
|
Percentage of
Revenues
|
Amount
|
Percentage
of
Revenues
|
|||||||||||||||||||
(in
thousands, except percentages)
|
||||||||||||||||||||||||
Display
drivers for large-sized applications
|
$ |
258,006
|
85.9 | % | $ |
470,631
|
87.1 | % | $ |
645,513
|
86.7 | % | ||||||||||||
Display
drivers for mobile handsets applications
|
12,607
|
4.2
|
31,123
|
5.8
|
52,160
|
7.0
|
||||||||||||||||||
Display
drivers for consumer electronics applications
|
21,754
|
7.3
|
18,571
|
3.4
|
28,616
|
3.8
|
||||||||||||||||||
Others(1)
|
7,906
|
2.6
|
19,879
|
3.7
|
18,229
|
2.5
|
||||||||||||||||||
Total
|
$ |
300,273
|
100.0 | % | $ |
540,204
|
100.0 | % | $ |
744,518
|
100.0 | % |
Note:
|
(1)
|
Includes,
among other things, operational amplifiers, timing controllers,
television
chipsets, television tuner modules and liquid crystal
injection.
|
Year
Ended December 31,
|
||||||||||||||||||||||||
2004
|
2005
|
2006
|
||||||||||||||||||||||
Amount
|
Percentage
of
Revenues
|
Amount
|
Percentage
of
Revenues
|
Amount
|
Percentage
of
Revenues
|
|||||||||||||||||||
(in
thousands, except percentages)
|
||||||||||||||||||||||||
CMO
and its affiliates
|
$ |
189,870
|
63.2 | % | $ |
318,008
|
58.9 | % | $ |
409,697
|
55.0 | % | ||||||||||||
CPT
and its affiliates
|
58,430
|
19.5 | % |
87,534
|
16.2 | % |
92,561
|
12.4 | % | |||||||||||||||
Others
|
51,973
|
17.3 | % |
134,662
|
24.9 | % |
242,260
|
32.6 | % | |||||||||||||||
Total
|
$ |
300,273
|
100.0 | % | $ |
540,204
|
100.0 | % | $ |
744,518
|
100.0 | % |
|
·
|
cost
of wafer fabrication;
|
|
·
|
cost
of processed tape used in TAB
packaging;
|
|
·
|
cost
of gold bumping, assembly and testing;
and
|
|
·
|
other
costs and expenses (primarily overhead and direct
labor).
|