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KIOXIA Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Smaller Package Size, Performance Improvements Contribute to Better User Experience on Mobile Applications

KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver. 4.0 embedded flash memory devices. Supported in capacities of 256 gigabytes (GB), 512GB, and 1 terabyte (TB)3, the new products are well suited for a variety of next-generation mobile applications, including leading-edge smartphones.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240423022703/en/

The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience. (Graphic: Business Wire)

The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience. (Graphic: Business Wire)

The enhanced performance4 of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience. A smaller package4 size contributes to board space efficiency and design flexibility.

KIOXIA was the first to introduce UFS technology5, and continues to develop new products. The latest UFS Ver. 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC standard package. UFS 4.0 incorporates MIPI® M-PHY® 5.0 and UniPro® 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.

Key Features include:

  • Read/write speed improvement over previous generation6: +15% sequential write, +50% random write and +30% random read.
  • Package size reduction over previous generation6: Package size is 9x13 and package thickness is 0.8mm (256GB and 512GB) and 0.9mm (1TB), resulting in an 18% reduction compared to the conventional package size (11x13).

Maitry Dholakia, vice president, Memory Business Unit, for KIOXIA America, Inc. emphasized the company's ongoing leadership in UFS technology, stating, "The newest generation of our UFS 4.0 devices is a testament to our commitment to continually push performance boundaries – and make an improved user experience a reality."

Sample shipments for the 256 and 512GB products begin this month, with the 1TB offering following in June 2024. For more information, please visit www.kioxia.com and follow the company on X, formerly known as Twitter and LinkedIn®.

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D flash memory technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative BiCS FLASH™ 3D flash memory technology is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers.

DISCLAIMERS:

© 2024 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.

FOOTNOTES:

1: Sample shipments will begin this month. Specification of the samples may differ from commercial products.

2: Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

3: In every mention of a KIOXIA product: Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications. The definition of 1KB = 2^10 bytes = 1,024 bytes. The definition of 1Gb = 2^30 bits = 1,073,741,824 bits. The definition of 1GB = 2^30 bytes = 1,073,741,824 bytes. 1Tb = 2^40 bits = 1,099,511,627,776 bits.

4: Compared to previous generation.

5: KIOXIA Corporation's first sample shipment, as of February 8, 2013.

https://www.kioxia.com/en-jp/business/news/2013/20130208-1.html

6: KIOXIA previous generation 512GB device

Read and write speeds are the best values obtained in a specific test environment at KIOXIA and KIOXIA warrants neither read nor write speeds in individual devices. Read and write speed may vary depending on device used and file size read or written.

TRADEMARKS:

LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries.

MIPI®, M-PHY® and UniPro® are registered trademarks owned by MIPI Alliance.

All other company names, product names and service names may be trademarks of their respective companies.

Contacts

MEDIA CONTACT:

Dena Jacobson

Lages & Associates

Tel.: (949) 453-8080

dena@lages.com

COMPANY CONTACT:

Mia Cool

KIOXIA America, Inc.

Tel.: (408) 526-3087

mia.cool@kioxia.com

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